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The quick progress in communication technologies demands superior electromagnetic interference (EMI) shielding materials. However, achieving a high shielding effectiveness (SE) with thin films, which is needed for microscale, flexible, and wearable devices, through absorption of EM radiation remains a challenge. 2D titanium carbide MXene, Ti3C2Tx, has been shown to efficiently reflect electromagnetic waves. In this paper, we investigated the electromagnetic shielding of ultrathin printed Ti3C2Tx films and recorded absorption up to 50% for 4 nm-thick films. This behavior is explained by impedance matching. Analysis of the sheet impedance in the X-band frequency range allows us to correlate the EMI shielding mechanism with the electrical conductivity measured within the same range. The average bulk in-plane conductivity for 4 to 40 nm-thick films reaches 106 S/m, while the average relaxation time is estimated at around 2.3 ps. Our figures of merit are similar to those reported for ultrathin metal films, such as gold, showing that an abundant MXene material can replace noble metals. We demonstrate that the MXene conductivity mechanism does not change from direct current to THz. The conventional method of reporting EMI SE is correlated with absolute values of transmitted, reflected, and absorbed power, which allows us to interpret previous results on MXene EMI shielding. Considering the easy deposition of thin MXenes films from solution onto a variety of surfaces, our findings offer an attractive alternative for shielding microscale devices and personal electronics. 

Abstract The origin of MXene's excellent electromagnetic shielding performance is not fully understood. MXene films, despite being inhomogeneous at the nanometer scale, are often treated as if they are compared to bulk conductors. It is reasonable to wonder if the treatment of MXene as a homogeneous material remains valid at very small film thickness and if it depends on the interlayer spacing. The goal of the present work is to test if the homogeneous material model is applicable to nanometer‐thin Ti₃C₂T_xMXene films and, if so, to investigate how the model parameters may depend on variations in MXene interlayer spacings. MXene films containing flakes with interlayer spacing between 1.9 and 5.5 Å have been prepared using various intercalating agents. It is shown that modeling the films as being homogeneous agrees with experimental tests in the microwave frequency range. Microwave conductivity and dielectric constant parameters are estimated for the homogeneous film model by fitting measured results. The direct current (DC) conductivity matches the estimated microwave conductivity on the order of magnitude. A highly effective dielectric constant provides a good fit for the lower conductivity MXene films. Optical absorption agrees with the homogeneous material model of thin films as well. 

Abstract Highly integrated, flexible, and ultrathin wireless communication components are in significant demand due to the explosive growth of portable and wearable electronic devices in the fifth‐generation (5G) network era, but only conventional metals meet the requirements for emerging radio‐frequency (RF) devices so far. Here, it is reported on Ti₃C₂T_xMXene microstrip transmission lines with low‐energy attenuation and patch antennas with high‐power radiation at frequencies from 5.6 to 16.4 GHz. The radiation efficiency of a 5.5 µm thick MXene patch antenna manufactured by spray‐coating from aqueous solution reaches 99% at 16.4 GHz, which is about the same as that of a standard 35 µm thick copper patch antenna at about 15% of its thickness and 7% of the copper weight. MXene outperforms all other materials evaluated for patch antennas to date. Moreover, it is demonstrated that an MXene patch antenna array with integrated feeding circuits on a conformal surface has comparable performance with that of a copper antenna array at 28 GHz, which is a target frequency in practical 5G applications. The versatility of MXene antennas in wide frequency ranges coupled with the flexibility, scalability, and ease of solution processing makes MXene promising for integrated RF components in various flexible electronic devices.